Possible Bonding Materials(接合可能な素材)

Possible Bonding Materials Possible Sizes  Small Lots・About Prototypes 

Possible Bonding Materials

Experience bonding many kinds of metals.

Yamatech has even successfully bonded materials other than SUS, which are said to be difficult for other companies. Yamatech has the skills and technology you can rely on,

* However, depending on the metal, there may be detailed condition settings necessary for processing, so please contact us.

Possible Materials for Diffusion Bonding at Yamatech

Stainless steel (SUS)
SUS303, SUS304, SUS310S, SUS316, SUS316L, SUS430, SUS420J2, SUS440, SUS447, generally all SUS

Nickel-based (Ni)
Alloy 42, Invar, Kovar, Inconel, Monel (Ni + Cu alloy)

Copper-based (Cu)
Oxygen-free copper, phosphor bronze, tough pitch copper

Aluminum (Al)
6061, 6063, 7075

Titanium (Ti)

Other metals
HPM7, HPM38, STAVAX, S55C, SKD61, etc.

Heterogeneous metals
Bonding SUS / copper / SUS 3-layers of dissimilar metals (conditions apply)

We have also been successful in joining other dissimilar metals, but under certain conditions, so please contact us by e-mail.

Contact us